Sputtered films are highly pure. Because of the nature of the process, no inclusions can be formed: this means no oxides, no carbides, no particle-void assemblies. As a result, the microstructure of sputtered films is free of most defects that lead to crack initiation and premature failure. Sputtered films can be loaded with up to 1.5% alternating strains, a value three times higher than standard Nitinol materials.
Also, sputtered Nitinol films have excellent corrosion behavior.
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